팹리스 반도체 모델
As a fabless semiconductor company, we focus our resources and talent on in-house design and research. We outsource the semiconductor manufacturing process to a network of global suppliers, which includes fabrication, assembly and test, and distribution. This model provides us with the flexibility to scale and diversify our manufacturing capacity based on customer requirements and the broader business environment. In selecting our suppliers, we strive to balance factors such as geographic diversification, technological capabilities, and competitive cost.
연구 개발
Cirrus Logic의 자체 엔지니어링 설계 팀이 새로운 반도체 아키텍처 및 재료를 탐색하여 집적 회로(IC)의 혁신에 박차를 가하고 있습니다.
설계 및 검증
Our engineers begin IC design in collaboration with our silicon layout designers, converting product specifications into the physical layout of components. This ensures that when the IC is built, it will meet both product specifications and our high-quality standards.
제작
제품 설계가 시작되면 우리는 구체적 제품 성능, 생산량, 품질 표준을 충족하는 파운드리를 선정합니다. 이들 첨단 파운드리는 순수 실리콘 웨이퍼 및 기타 원자재를 사용하여 당사의 사양에 맞는 컴포넌트를 생산합니다.
어셈블리 및 테스트
Cirrus Logic products then leave the foundry in wafer form and ship directly to our highly specialized vendors for final assembly and test. At this point in the packaging process, wafers are transformed into devices that are capable of interfacing with customer end applications.
패키징 및 유통
We use high-quality, JEDEC-compliant packaging to ensure safe shipment of our products to their destination. Working closely with our global third-party distribution providers, we then deliver products to customers’ production lines.
